The Next Platform

Stampede3: A Smaller HPC System That Will Get More Work Done

All of the major HPC centers of the world, whether they are funded by straight science or nuclear weapons management, have enough need and enough money to have two classes of supercomputers. They have ...
Nasdaq

CDNS Unveils LPDDR6/5X Memory IP System for Next-Gen AI & HPC Workload

Cadence Design Systems (CDNS) recently announced the tapeout of the industry’s first LPDDR6/5X memory IP system solution, capable of operating at an impressive 14.4Gbps—a 50% speed boost over previous ...
Semiconductor Engineering

Maximize Memory Security Of HPC SoCs With Efficient Crypto IP

Data that is created and transferred between billions of devices and the cloud is growing exponentially. More and more devices are entering the market, the cloud is expanding to the network edge and ...
TMCnet

AP Memory Broadens S-SiCap™ Technology Deployment to Support Evolving AI and HPC Needs

To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap TM Gen4 is the first to adopt embedded substrate packaging and is currently in the ...
insideHPC

HPC and AI Workloads Drive Storage System Design

High performance computing (HPC) and artificial intelligence (AI) are increasingly used across industries and are reshaping the future. HPC and AI workloads are used by organizations including ...
Business Wire

Intel’s Broad, Open HPC+AI Portfolio Powers Performance, Generative AI for Science

At ISC’23, Intel details competitive performance for diverse HPC and AI workloads, from memory-bound to generative AI, and introduces new science LLM initiative to democratize AI. HAMBURG, ...
The Next Platform

The Art Of System Design As HPC And AI Applications Diverge

Predicting the future is hard, even with supercomputers. And maybe specifically when you are talking about predicting the future of supercomputers. As we noted many years ago, the fact that AI ...
Semiconductor Engineering

3D-IC Market Outlook: Technology Roadmaps, Readiness, And Design Implications

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
insideHPC

Six Platform Investments from Intel to Facilitate Running AI and HPC Workloads Together on Existing Infrastructure

Because HPC technologies today offer substantially more power and speed than their legacy predecessors, enterprises and research institutions benefit from combining AI and HPC workloads on a single ...
EDN

HPC Platform Selects Altera Stratix II FPGA Family for New HMPE System

Altera Corporation has announced that HPC Platform of Paris, France, has selected two members of the Stratix II FPGA family for use in their ultra-low latency system for market data processing, ...
Fox 5 San Diego

Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors

BOISE, Idaho, Nov. 10, 2022 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq: MU) today announced availability of DDR5 memory for the data center that is validated for the new AMD EPYC™ 9004 ...