ECIA has released its annual Top 50 Worldwide Authorized Distributors report. This report is the latest update of the true, original “Top 50 Worldwide Authorized Distributors” research that was ...

GPV reported improved second-quarter profitability as operational and structural changes boosted earnings despite continued material availability constraints. Second-quarter sales rose 5% sequentially ...

PEACHTREE CITY, GA – PCB West 2026 offers 11 presentations on circuit assembly processes across two days in September at the Santa Clara (CA) Convention Center. The two-day event on September 29-30 ...

HORTEN, NORWAY – Norautron has acquired UK-based electronics manufacturing services (EMS) provider Jaltek, expanding its manufacturing footprint into the United Kingdom and strengthening its ...

ROLLING MEADOWS, IL -- BEST, a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing reliable methods for salvaging electronic components ...

Zero Defects International [ZDI] has announced a significant testing capacity increase for flying-probe ICT services. This addition of new state of the art equipment enables ZDI to actually more that ...

Cranston, Rhode Island – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Bruce Gao as Sales Manager, ...

Dallas, TX – StenTech Inc., North America's leading provider of SMT printing solutions and precision manufacturing technologies, today announced a series of strategic investments that further expand ...

WASHINGTON – Global semiconductor sales reached $403 billion in the second quarter of 2026, rising 35% from the first quarter, according to the Semiconductor Industry Association (SIA).

BANNOCKBURN, IL – North American electronics manufacturing services (EMS) shipments increased 6% year-over-year in June, while the industry’s book-to-bill ratio reached 1.33, according to the Global ...

Designed for electronics manufacturing, prototyping and production environments, the FX-310 wave soldering pot features a two-piece architecture with a separate control module and flat-top design to ...

TrendForce said Nvidia's primary objective with Rubin Ultra is increasing I/O speed. Successful qualification of HBM4e could enable speeds of 14–16Gbps, compared with 8–11.7Gbps for Rubin. An ...